General function of inspection software
Semi-Conductor process
Inspecting surface (for SOP, TSSOP)
Void on PKG
Chipped PKG
Chipped Mark, Thin Mark
No Mark
Different Mark
Missing direction
No lead
Bended lead
Length of top lead
Inspecting back face (for QFN/VSP/SON)
Inspecting back face (For BGA/CSP/LGA)
Inspecting board circuit
Short
Open
Pin hole
Intrusion
Protrusion
Contamination
Inspecting other products
Molding products:
Measure distance
Inspecting rubbish
Screw:
360 ° crush
Rubbish
Plastic products:
Measure distance, rubbish
Immature mold
Plastic products:
Inspecting holes

Plastic products:
Measure distance
Rubbish
Automobile parts:
360 ° scratch, chipped
Rubbish