Overview the vision system
Camera captures image of product into computer systems. Image processing software analyzes images then judges inspection results and transmits this results to control unit. Control unit sorts the inspected product according to inspection result, while shown this result on the screen.
For detail
Some typical projects which we manufactured and Transferred
Harness Inspection Unit
Objects products:0.5mm~3mm
Processing speed:120pcs/m ±10%
Jam rate:0/3000 pcs
Inspection surface:Whole surface 360°
Inspection content:Stand out, Conductor Cut, No Bell Mouth, Deep Crimp, ...
Capacity inspection:100μm×100μm
Capacity measurement:100μm3Σ
Angle rubber Inspection machine
Objects products:10*10*20 mm
Processing speed:70pcs/m ±10%
Jam rate:0/3000 pcs
Inspection surface:Whole surface (6 side)
Inspection content:Foreign substance, Scratch, Excessive Flash, measure distance, ...
Capacity inspection:800μm×800μm
Capacity measurement:100μm3Σ
Disc holder inspection Machine
Objects products:7mm~10mm
Processing speed:0.35 s/pc ±10%
Jam rate:0/3000 pcs
Inspection surface:Face
Inspection content:Crack, Patch, dirty, deformation
Capacity inspection:30μm×30μm
Resin Pilot inspection machine
Objects products:3mm ×Φ1mm
Processing speed:480 pcs/phút ±10%
Jam rate:0/3000 pcs
Inspection surface:Whole surface
Inspection content:Crack, Patch, dirty, deformation
Capacity inspection:10μm×10μm
O-ring Inspection machine
Objects products:3mm~7mm
Processing speed:100pcs/phút ±10%
Jam rate:0/3000 pcs
Inspection surface:Whole surface
Inspection content:Dirty, measure thickness, measure diameter
Capacity inspection:100μm×100μm
Capacity measurement:10μm3Σ
Automobile braker Inspection machine
Objects products:15mm~26mm
Processing speed:4s/pc ±10%
Jam rate:0/3000 pcs
Inspection surface:Whole surface
Inspection content:Dirty, Scratch, measure distance, thickness
Capacity inspection:100μm×100μm
Capacity measurement:5μm3Σ
IC(TSSOP) Inspection Machine
Objects products:4mm~15mm
Processing speed:0.64 s/pc ±10%
Jam rate:0/3000 pcs
Inspection surface:Face or back
Inspection content:Lead, Mark, PKG
Capacity inspection:100μm×100μm
Capacity measurement:10μm3Σ
Chip Inspection Machine
Objects products:Wafer 5 Inch ~8 Inch
Chip size 0.4mm ~4mm
Processing speed:45 minutes/Wafer 6 Inch ±10%
Jam rate:0/3000 pcs
Inspection surface:Face of wafer
Inspection content:Chip crack, miss dicing, dirty
Capacity inspection:8μm×8μm
The problem is often considered in visual inspection process
If you are considering the problems below in your visual inspection process:
  • Your visual inspection vision system couldn't detect some mode of rejects
  • Rejects flow out your customer while you have visual inspection department
  • You want to apply a visual inspection system instead of human to increase productivity and quality
  • You need to manufacture a visual inspection automation machine
  • ...........
Please contact us without hesitate!
We are very willing to research and make the solution with you.