Chip wafer inspection machine
(IC inspection & Taping machine)
Objects products: Wafer 5 Inch ~8 Inch
Chip size 0.4mm ~4mm
Processing speed: 45 minutes/Wafer 6 Inch ±10%
Jam rate: 0/3000 pcs
Inspection surface: Face of wafer
Inspection content: Chip crack, miss dicing, dirty
Capacity inspection: 8μm×8μm
Operation route:
Put wafer to inspection stage. Camera is moved by XY axis to captute image of one by one of chip for inspecting
If inspection result is NG, information of mapfile is changed for this chip
Some images NG samples which machine detected

Crack, dicing miss

Dirty, rubbish